Method of manufacturing a flexible electronics module

ABSTRACT

A method of manufacturing a flexible electronics module includes mounting at least two functional components onto a flexible substrate, forming stretchable electrical interconnects configured to provide connection between the two functional components, and cutting shapes into the flexible substrate to increase an ability of the flexible substrate to stretch and flex, wherein the electrical interconnects to the functional components are placed to avoid the shapes.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.12/916,221, filed Oct. 29, 2010, titled “Stretchable Electronics Modulesand Circuits,” which is incorporated herein in its entirety.

BACKGROUND

Renewable energy resources, such as wind and solar, have become muchmore popular as people seek alternative energy sources. With the rise indemand, solar products have undergone considerable changes from thetraditional, large area solar panels in rigid frames. Solar panels havebecome smaller, lighter and much more modular.

Some photovoltaic modules now reside on flexible, bendable substrates.Manufacturers that produce flexible solar modules include Unisolar,Global Solar and Konarka. These flexible solar substrates generallyconsist of thin, stainless steel foil or thin, polymer foil. In additionto photovoltaic modules, these substrates may also include sensors orother electronic modules and circuits. While these substrates have moreflexibility and are more bendable than previous substrates, there isstill room for improvement.

Some efforts have concentrated on bending more traditional substrates byselectively cutting or notching the substrates to allow them to conformto more three-dimensional shapes. Examples of this approach include U.S.patent application Ser. No. 12/017,974, published as US PatentPublication No. 20090184954; and Ser. No. 12/253,390, Published as20100096729. In the approach discussed in these publications, anelectronics circuit and its components are laid out on a flexiblecircuit substrate. The process then cuts the flexible circuit substrateto allow it to be bent, shaped or molded into a three-dimensionaldevice.

Similarly, U.S. patent application Ser. No. 12/563,945, “Shaped ActiveMatrix Displays,” discusses a combination of the cutting for shaping andthe lay out of the circuits to allow for perforations to be formed inthe substrate, or for the substrate to take a particular shape, such asthat of an alphabetic character.

The approach taken in these references, however, involves cutting orperforating the substrate for flexibility and shaping, it does notaddress stretchability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an embodiment of an electronics module having a flexible,perforated substrate.

FIG. 2 shows a top view of a perforated substrate and variations onshapes of perforations.

FIG. 3 shows an embodiment of an electronics module having a flexible,perforated substrate.

FIG. 4 shows an embodiment of an electronics module having a flexible,perforated substrate encapsulated in an elastomer.

FIG. 5 shows a flow chart of a method of manufacturing an electronicsmodule.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 1 shows an embodiment of an electronics module having a flexible,perforated substrate 10. The term module as used here means a set ofelectronically functional components 18 residing on the substrate 10,where at least two of those functional components have electricalconnections between them. An electronically functional component mayprovide electrical power; use or exchange power; generate, receive orexchange electrical signals with other functional components, asexamples. The functional components may consist of many different types,including a solar cell component, a battery, a display component, apower regulator, pixel circuits, memory cells, light emitting devices,MEMS devices and a sensor.

The display components may consist of electrophoretic display,electrochromic display, liquid crystal display, MEMS interferencedisplay, electrowetting display, powder display, electrochemicaldisplay, organic or inorganic light emitting display, and plasmadisplay. The sensor component may consist of a photodiode, anaccelerometer, a pressure sensor, a motion sensor, a moisture sensor, agas sensor, a radiation sensor, a biological sensor, or a chemicalsensor.

The functional components reside on a flexible substrate. The flexiblesubstrate may consist of stainless steel foil, polymer foil, polyimidefoil, polyester such as Mylar™ foil and polyethylene naphthalate (PEN)foil, paper or paper-like material or a woven or non-woven fabric. Forease of discussion, the embodiments shown in FIGS. 1-3 have theelectrical interconnects such as 14 underneath the functionalcomponents. This will generally result from the electrical interconnectsbeing formed prior to the mounting of the functional components, as willbe discussed in more detail below.

The forming of the electrical interconnects may result from one of manyprocesses. If the flexible substrate 10 consists of a conductivematerial, an insulative coating may reside on the surface of theconductive material, with selected parts removed to expose theconductive portions. Alternatively, the interconnects 14 could be formedvia printing or metal deposition and selective etching. The interconnect14 may be, for example, deposited and patterned by screen printing ofconductive silver paste. While it is not required that the interconnectsbe stretchable, an advantage lies in the use of stretchable materials,such as electrically conductive pastes, elastomers and flexiblepolymers. Examples of stretchable conductors are Metalon FS-066 andFS-067 stretchable nanosilver ink from NovaCentrix of Austin, Tex.,which retains conductivity up to 100% elongation, or Metallograph™elastic conductive inks from IIMAK of Amherst, NY. The functionalcomponents in this embodiment lay on the top of the interconnects,possibly assisted by an electrically conductive adhesive 16 to promote arobust electrical connection. The connection 16 may also be a solderconnection.

The functional components may result from being manufactured on thesurface of the flexible substrate such as by printing or thin-filmtechniques such as evaporation, sputtering or chemical vapor deposition.Alternatively, the functional components may result from a separatemanufacturing process and then mounted as discrete elements. Themounting process may include transfer printing or pick-and-placetechnology. In one example the functional components may be regions orparts of back contact solar cells, including metal or emitterwrap-through cells. A solar cell wafer may be diced into smaller solarcell chips by sawing or laser dicing. These chips are then transferredonto the flexible substrate and bonded to the conductive traces 14 ofthe flexible substrate. In some cases, anisotropic conductive tape maybe used to form the contact between the functional element and theconducting traces on the substrate.

An advantage of the printing and thin-film technique formation lies inthe ability to form potentially less expensive modules and modules witha thinner form factor. However, an advantage of mounting the functionalcomponents as discrete elements lies in the ability to place themappropriately on the flexible substrate to avoid the perforations suchas 12 and in the ability to use high performance devices that are madeusing high temperature processes. Both processes could be done inthrough roll-to-roll or web print processing.

The perforations have shapes and positions to allow the substrate tostretch. Flexible substrates can generally bend and twist, but notstretch. By selectively perforating the substrate, one can allow thesubstrate to stretch. FIG. 2 shows a top view of a portion of a flexiblesubstrate 10 having perforations. In one particular example, theperforations such as 12 perforate the substrate vertically as orientedon the page. These will allow the substrate to stretch horizontally inthe direction of the arrow 30. The perforations typically havelongitudinal shape with a lateral dimension much wider than alongitudinal dimension. In one example they are simple longitudinal cutsin which the substrate material is only perforated without removing asubstantial amount of substrate material. As described below, the cutsmay have more complex shapes such as zigzag or curved shapes. However,the perforations also may have removed some substrate material.Nevertheless, in such a case, the shape of the perforations or theapertures, is much wider in one direction than in the other direction.For example, the perforation could have a rectangular shape with anaspect ratio (lateral: longitudinal dimension) of at least 1:10.Alternatively, the perforations 34 have perforated the substratehorizontally, allowing the substrate to stretch vertically in thedirection of the arrow 32. The perforations are arranged so that atensile force on the substrate causes a torsional moment on segments ofthe substrate. This torsional moment causes an out of plane twist ofsegments of the substrate material which in turn results in stretchingof the substrate. The direction of the perforations may also vary inareas to allow stretchability in various directions. For example, areaswith horizontal perforations may be located adjacent to areas withvertical perforations. Or, horizontal and vertical perforations may beintermixed.

Alternative configurations of perforations include angled perforationssuch as 38 and ‘S-shaped’ perforations such as 36 or zigzag patterns.The perforations may take many shapes, left up to the designer, to meetwhatever stretchability requirements the substrate may have. Inaddition, the functional components such as 18 with interconnects suchas 14 may take on a shape that conforms to the shapes of theperforations, as shown by the component 18 having one end to match theS-shaped perforation. The functional elements may be located in betweenor partially in between the perforation or they may cover some of theperforations. If they cover some perforations, the substrate may beprevented from stretching in this area if the functional elements arerigid. The spacing between the functional elements then determines thedegree of stretchability that is allowed.

FIG. 3 shows an optional elastomer encapsulation 20. The elastomer mayconsist of such materials as silicone, urethane or acrylate. While theelastomer may coat the apertures, cuts or perforations, it is elasticitself so it would not prohibit stretching. The elastomer may protectthe functional components, interconnects and the substrate fromcontaminants or moisture, may assist in solidifying electricalconnections and may prevent uncontrolled tearing at the perforationsunder stretching stress. The encapsulation may also carry perforationsand the perforations may have been fabricated after applying theencapsulation as shown by perforation 19. In the latter case, theencapsulation does not have to be an elastomeric material. Theencapsulation may be applied by a coating step such as dip coating,spray coating or lamination. For example, a dip-coated fluorocarboncoating such as Cytop (Asahi Glass) or dip-coated silicone materialssuch as 1-2577 conformal coating from Dow Corning may be used. It mayalso be evaporated such as in the case of evaporated Parylene. Laminatedencapsulation materials may include moisture barrier materials such asthe Scotchpak series from 3M Corporation. The encapsulation material maybe transparent to light where it is required, such as in the case of thefunctional elements being photosensors, solar cells or light emitting ofdisplay devices.

As discussed above, the embodiments of FIGS. 1-3 show the functionalcomponents laying on top of the electrical interconnects, bonded to themsimilar to flip-chip devices. Alternatively, the functional componentsmay be mounted onto the substrate first and then the interconnectsformed between them. FIG. 4 shows an embodiment of an electronics modulehaving later-formed interconnects. In this particular example, thefunctional components such as 18 attach to the substrate by an adhesive22.

The functional component 18 has its electrical connections on the topsurface of the component to allow later-formed connections aftermounting. In order to facilitate the printing of the interconnects toreach the electrical connections, a ramp 24 may be printed on the sidesof the functional components 18. This allows the printing of theinterconnect material 26 on the ramp to reach the top electricalconnections.

FIG. 5 shows an embodiment of the manufacturing process, which has highflexibility. The flexible substrate is provided at 40. In oneembodiment, the functional components are mounted first at 42. Theinterconnects may then be formed as discussed above and then theperforations made last at 44. Alternatively, the perforations may bemade next and then the interconnects printed to account for theperforations. In yet another embodiment, the perforations may occurlast, with the perforations going through the encapsulant as well.

In another approach, the interconnects may be formed on the substratefirst at 44. The perforation of the substrate may then occur at 46.Finally, with the interconnects and perforations completed, thecomponents may be mounted at 42. Alternatively, the perforations mayoccur prior to the formation of the interconnects.

In yet another approach, the substrate may be perforated first at 46.The interconnects may then be formed at 44 and then the functionalcomponents mounted at 42. Alternatively, the functional components maybe mounted at 42 and then the interconnects formed at 44.

As discussed previously, the mounting of the functional components mayactually include the actual manufacture of the functional components.The functional components may be manufactured, on the substrate or in aseparate process, to have shapes that conform to the perforations.

As discussed above, the perforations of the substrate are configured toallow the substrate to be stretchable. The specific design needs willdictate in which direction or directions the substrate needs to stretch.That in turn will dictate the shape and placement of the perforations.The actual perforations may result from laser cutting, stamping, cuttingor other types of machining.

It will be appreciated that several of the above-disclosed and otherfeatures and functions, or alternatives thereof, may be desirablycombined into many other different systems or applications. Also thatvarious presently unforeseen or unanticipated alternatives,modifications, variations, or improvements therein may be subsequentlymade by those skilled in the art which are also intended to beencompassed by the following claims.

What is claimed is:
 1. A method of manufacturing a flexible electronicsmodule, comprising: mounting at least two functional components onto aflexible substrate having conductors; forming stretchable electricalinterconnects from stretchable conductive materials to provideconnection between the at least two functional components such that eachfunctional component contacts at least one interconnect that connects tothe other function components; perforating the flexible substrate in afirst direction to increase stretchability of the flexible substrate ina second direction after formation of the stretchable electricalinterconnects to increase an ability to the flexible substrate tostretch and flex, wherein perforations are arranged in the firstdirection to avoid the stretchable electrical interconnects to thefunctional components, the functional components arranged to one ofreside between the perforations or partially cover the perforations; andwherein the functional components have shapes that are at leastpartially conformal to shapes of the perforations in the substrate. 2.The method of manufacturing of claim 1, wherein perforating the flexiblesubstrate occurs prior to the mounting of the functional components. 3.The method of manufacturing of claim 1, wherein mounting the functionalcomponents occurs prior to the perforating of the flexible substrate. 4.The method of manufacturing of claim 1, wherein forming the electricalinterconnects between the functional components occurs prior to themounting of the functional components.
 5. The method of manufacturing ofclaim 1, further comprising encapsulating the electronics module with anelastomer after the mounting, forming and perforating.
 6. The method ofmanufacture of claim 1, wherein perforating the flexible substratecomprises cutting the flexible substrate with one of angled cuts, curvedcuts, or ‘S’ shaped cuts.
 7. The method of manufacture of claim 1,wherein forming the electrical interconnects comprises printing aconductive material onto the flexible substrate.